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PRELIMINARY CM3018 Micropower, 150mA Low Noise CMOS Regulator with Fast Response
Features
* * * * * * * * * * * * * Available with 1.5V, 1.8V, 2.5V, 2.6V, 2.8V, 2.85V, 2.9V, 3.0V, 3.1V or 3.3V outputs Fast (60s) VOUT response when enabled Ultra low noise (35V rms typ.) Delivers up to 150mA output current Very low dropout (150mV at 150mA) Low quiescent operating current (110A) Stable with low-ESR ceramic capacitors "Zero" disable mode current consumption Thermal overload protection Foldback overload current protection -40C to +85C temperature operation Available in a 5-pin SOT23 and 5-bump Chip Scale Packages (CSP) Lead-free versions available
Product Description
The CM3018 is a very low dropout, low noise regulator that delivers up to 150mA of load current at a fixed output voltage. A dedicated control input (EN, Active High) provides power-up sequencing flexibility. When this input is taken low, the regulator is disabled. In this state, the supply current will drop to near zero. An internal discharge MOSFET resistance (300) will force the output to ground whenever the device is disabled. An optional bypass pin is provided for further improvement of noise performance and to maximize the power supply ripple rejection. The CM3018 is fully protected, offering both overload current limiting and high temperature thermal shutdown. The CM3018 is available in a tiny 5 lead SOT-23 package or a 5-bump CSP and is ideal for space critical applications. The CSP version of the CM3018 incorporates OptiGuardTM technology to provide increased reliability at assembly. All versions of the CM3018 are now available with optional lead-free finishing.
Applications
* * * * * * Wireless handsets, PDAs, MP3 players, digital cameras PCs and notebooks Graphics cards, set-top boxes Compact Flash memory cards Battery-powered devices PC cards
Typical Application Circuit
CM3018
VIN VOUT + GND CIN EN + 1F CBYP
10nF
Simplified Electrical Schematic
VIN EN
VOUT
OUT
BYP +
VREF
BYP GND
COUT
+ 1F
1x
GND
(c) 2004 California Micro Devices Corp. All rights reserved. 07/29/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
1
PRELIMINARY CM3018
Pin / Bump Descriptions
PIN / BUMP DESCRIPTIONS
SOT23-5 PIN 1 CSP BUMP C3 NAME VIN DESCRIPTION The input power supply for the regulator. If this input is within a few inches of the main supply filter, a capacitor may not be necessary. Otherwise an input filter capacitor of approximately 1F will ensure adequate filtering. The negative reference for all voltages. A logic input control to enable the regulator output. When EN is asserted (logic high), it allows output regulation to commence. When EN is deasserted (logic low), the regulator pass transistor is forced into a high impedance mode, and an internal discharge resistance (300) is applied to the output. This pin is connected to the internal voltage reference of the regulator. An external bypass capacitor CBYP of 10nF is recommended to improve the noise performance and to maximize the power supply ripple rejection. The regulator voltage output used to power the load. A nominal output capacitor of 1F is sufficient to minimize any transient disturbances under normal operating conditions. Additional output capacitance can be used to further improve transient load response.
2 3
B2 A1
GND EN
4
A3
BYP
5
C1
VOUT
Package / Ordering Information
SOT23-5 Package PACKAGE / PINOUT DIAGRAM
Top View
VIN GND EN 1 5 VOUT
ENxx
4 BYP
2 3
Note: This drawing is not to scale.
5-pin SOT23
SOT-23 PART NUMBERING INFORMATION
SOT23-5 PKG. Pins 5 5 5 5 5 5 5 5 2 Standard Finish Ordering Part Part Marking Number1 CM3018-15ST EA15 CM3018-18ST EA18 CM3018-25ST EA25 CM3018-28ST EA28 CM3018-29ST EA29 CM3018-30ST EA30 CM3018-31ST EA31 CM3018-33ST EA33 Lead-free Finish Ordering Part Part Marking Number1 CM3018-15SO EG15 CM3018-18SO EG18 CM3018-25SO EG25 CM3018-28SO EG28 CM3018-29SO EG29 CM3018-30SO EG30 CM3018-31SO EG31 CM3018-33SO EG33
www.calmicro.com
07/29/04
Output Voltage 1.5V 1.8V 2.5V 2.8V 2.9V 3.0V 3.1V 3.3V
Package SOT23-5 SOT23-5 SOT23-5 SOT23-5 SOT23-5 SOT23-5 SOT23-5 SOT23-5
(c) 2004 California Micro Devices Corp. All rights reserved.
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214
Fax: 408.263.7846
PRELIMINARY CM3018
Package / Ordering Information (Cont'd)
Chip Scale Package PACKAGE / PINOUT DIAGRAM TOP VIEW (Bumps Down View)
Orientation Marking (see note 2)
BOTTOM VIEW (Bumps Up View)
123
VOUT VIN
A B C
C1
GND
C3 B2
nn
Pin "A1" Marking
EN
BYP
A1
A3
A1
Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
CM3018 CSP Package
PART NUMBERING INFORMATION
Standard Finish CSP BUMPS 5 5 5 5 5 5 5 5 5 5 Output Voltage 1.5V 1.8V 2.5V 2.6V 2.8V 2.85V 2.9V 3.0V 3.1V 3.3V Package CSP CSP CSP CSP CSP CSP CSP CSP CSP CSP Ordering Part Number1 CM3018-15CS CM3018-18CS CM3018-25CS CM3018-26CS CM3018-28CS CM3018-2JCS CM3018-29CS CM3018-30CS CM3018-31CS CM3018-33CS Part Marking MA MB MC MD ME MF MG MH MJ MK Lead-free Finish2 Ordering Part Number1 CM3018-15CP CM3018-18CP CM3018-25CP CM3018-26CP CM3018-28CP CM3018-2JCP CM3018-29CP CM3018-30CP CM3018-31CP CM3018-33CP Part Marking MA MB MC MD ME MF MG MH MJ MK
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
(c) 2004 California Micro Devices Corp. All rights reserved. 07/29/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
3
PRELIMINARY CM3018
Specifications
ABSOLUTE MAXIMUM RATINGS
PARAMETER ESD Protection (HBM) Pin Voltages VIN (pin 1) EN (pin 3) VOUT (pin 5) Storage Temperature Range Operating Temperature Range Ambient Junction Power Dissipation (Notes 1,2) RATING +2000 [GND - 0.6] to [+6.0] [GND - 0.6] to [VIN + 0.6] [GND - 0.6] to [VIN + 0.6] -65 to +150 -40 to +85 0 to +130 Internally Limited UNITS V V V V C C C W
Note 1: The CM3018 contains a thermal overload circuit that automatically disables the device thereby preventing excessive junction temperature. For example, a SOT23-5 packaged device mounted on a typical multi-layer board with a moderate heat spreading copper area (2 square inches) will allow up to 0.315W to be safely dissipated, maintaining a safe operating temperature. Please consult with factory for thermal evaluation assistance. Note 2: Consult CAMD Technical Support to obtain detailed power dissipation information for the CM3018 packaged in the SOT23 and CSP packages.
STANDARD OPERATING CONDITIONS
PARAMETER VIN Ambient Operating Temperature Range Load Current COUT RATING 2.7 to 5.5 -40 to +85 0 to +150 1 20% UNITS V C mA F
(c) 2004 California Micro Devices Corp. All rights reserved.
4
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
07/29/04
PRELIMINARY CM3018
Specifications (continued)
ELECTRICAL OPERATING CHARACTERISTICS (SEE NOTE 1)
SYMBOL VOUT PARAMETER Regulator Output Voltage CONDITIONS TA = 25C; 0mA < ILOAD < 150mA; VIN-VOUT = 1V 0C < TA < 125C; 0mA < ILOAD < 150mA; VIN-VOUT = 1V -40C < TA < 125C; 0mA < ILOAD < 150mA; VIN-VOUT = 1V VOUTRT Regulator Response Time No Load; COUT = 1f Ceramic Cap 0mA < ILOAD < 150mA VIN-VOUT = 1V; 10mA < ILOAD < 150mA 3.3V < VIN < 4.3V; ILOAD = 5mA MIN -1% -2% -3% 60 1 .25 0.15 400 VOUT < 1V EN tied to ground; VIN = 3.0V with EN tied to VIN; ILOAD = 0mA: with EN tied to VIN; ILOAD = 150mA: with EN tied to GND (Disable Mode): VIH VIL IEN TDISABLE THYST PSRR Enable High Threshold Enable Low Threshold Enable Input Current Shutdown Temperature Thermal Hysteresis Ripple Rejection = 120Hz; VIN - VOUT = 1V; ILOAD= 100A; COUT = 1F Ceramic; CBYP = 10nF 300Hz-100kHz; COUT = 10F Ceramic; CBYP = 10nF Regulator enabled Regulator shutdown VEN > 0.8V 0.4 200 300 100 110 0.1 0.8 0.7 .01 150 15 60 200 250 10 1.2 1.3 TYP MAX +1% +2% +3% UNITS V V V s % %/V mA mA A A A V V A C C dB
RDROPOUT Dropout Resistance VR LOAD VR LINE ILIM ISC RDISCH IGND Load Regulation Line Regulation Overload Current Limit Short Circuit Current Limit Discharge Resistance Ground Current
eN
Output Noise
35
Vrms
Note 1: Electrical operating characteristics are guaranteed over standard operating conditions unless otherwise noted.
(c) 2004 California Micro Devices Corp. All rights reserved. 07/29/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
5
PRELIMINARY CM3018
Performance Information
Typical Noise Characteristics Curves shown for CM3018-33, 3.3V output unless noted otherwise
Power Supply Ripple Rejection
80 60 50 40 30 20 10 0 10 100 1000 10000 Frequency [Hz] 100000
Power Supply Ripple Rejection
80
Ripple Rejecttion [dB]
Ripple Rejecttion [dB]
70
100uA 1mA 10mA Vin = 4.3V, Vout = 3.3V Cout = 10uF cer. Cbyp = 10nF
70 60 50 40 30 20 10 0 10 100 1000 10000 Frequency [Hz] 100000
100uA 150mA Vin = 4.3V, Vout = 3.3V Cout = 1uF cer. Cbyp = 10nF 1mA 10mA
150mA
Power Supply Ripple Rejection
80
Ripple Rejecttion [dB]
70 60 50 40 30 20 10 0 10 100 1000 10000 Frequency [Hz] 100000
100uA 1mA Vin = 4.3V, Vout = 3.3V Cout = 1uF cer. NO Byp cap
10mA
150mA
Noise Performance
1.E-05 1.E-05
Noise Performance
Voltage [V]
Voltage [V]
1.E-06
1.E-06
1.E-07
Vin = 4.8V, Vout = 3.3V Cout = 1uF cer. Cbyp = 10nF 100uA load 1000 frequency [Hz] 10000 100000
1.E-07
1.E-08 100
1.E-08 100
Vin = 4.8V Vout = 3.3V Cout = 10uF cer. Cbyp = 10nF 100uA load 1000 frequency [Hz] 10000 100000
(c) 2004 California Micro Devices Corp. All rights reserved.
6
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
07/29/04
PRELIMINARY CM3018
Performance Information (cont'd)
Typical DC Characteristics (nominal conditions unless otherwise specified) Curves shown for CM3018-33, 3.3V output unless noted otherwise
Ground Current vs. Input (5mA Load)
150
GROUND CURRENT [uA]
Ground Current vs. Load (VIN = 5V)
150
Ground Current [uA]
125 100 75 50 25 0
100
50
0 0 1
INPUT VOLTAGE [V]
2
3
4
5
6
0
50 100 150 Load Current [mA]
200
Load Regulation (VIN = 5V)
3.40
Dropout Voltage vs. Load Current (VOUT = 3.25V)
200
DROPOUT VOLTAGE [mV]
OUTPUT VOLTAGE [V
3.35
150 100
3.30
3.25
50 0
3.20 0 100 200 300
LOAD CURRENT [mA]
0
50
100
150
200
LOAD CURRENT [mA]
Line Regulation (5mA Load)
3.7
OOUTPUT VOLTAGE [V]
Foldback Current Limiting (VIN = 3.8V) 4.0
OUTPUT VOLTAGE [V]
3.5 3.3 3.1 2.9 2.7 2.5 2.5 3.0 3.5
INPUT VOLTAGE [V]
3.0
2.0
1.0
0.0
4.0 4.5 5.0 5.5 6.0
0
100
200
300
400
500
LOAD CURRENT [mA]
(c) 2004 California Micro Devices Corp. All rights reserved. 07/29/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
7
PRELIMINARY CM3018
Performance Information (cont'd)
Typical Transient Characteristics (nominal conditions unless specified otherwise) Curves shown for CM3018-33, 3.3V output unless noted otherwise
Load transient (10% to 100%) Step Response Line Transient (1Vpp) Step Response
Enable Response (CBYP = 10nF)
Disable Response (CBYP = 10nF)
EN
EN
VOUT
VOUT
NO Load COUT = 1uF Cer.
NO Load COUT = 1uF Cer.
(c) 2004 California Micro Devices Corp. All rights reserved.
8
430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
07/29/04
PRELIMINARY CM3018
Performance Information (cont'd)
Typical Thermal Characteristics The overall junction to ambient thermal resistance (JA) for device power dissipation (PD) consists primarily of two paths in series. The first path is the junction to the case (JC) which is defined by the package style, and the second path is case to ambient (CA) thermal resistance which is dependent on board layout. The final operating junction temperature for any set of conditions can be estimated by the following thermal equation: TJUNC = TAMB + PD (JC) + PD (CA) = TAMB + PD (JA) SOT-23 Package Considerations When the SOT23 version of the CM3018 is mounted on a double-sided printed circuit board with two square inches of copper allocated for "heat spreading", the resulting JA is 175C/W.
OUTPUT CHANGE [mV]
Ground Current vs. Temperature (VIN=5V)
GROUND CURRENT [uA]
100 80 60 40 20 0 0 25 50 75
o
100
125
TEMPERATURE [ C]
Output Voltage Change vs. Temperature (VIN=5V, 1mA Load)
50 40 30 20 10 0 -10 -20 -30 -40 -50 -50 -25
TEMPERATURE [oC]
Based on a maximum power dissipation of 320mW (Load x VIN-VOUT = 150mA x 2.2V) with an ambient of 70C the resulting junction temperature will be: TJUNC = TAMB + PD (JA) = 70C + 315mW (175C/W) = 70C + 57.75C = 127.75C Thermal characteristics were measured using a double sided board with two square inches of copper area connected to the GND pins for "heat spreading". Measurements showing performance up to a junction temperature of 125C were performed under light load conditions (1mA). This allows the ambient temperature to be representative of the internal junction temperature. Note: The use of multi-layer board construction with separate ground and power planes will further enhance the overall thermal performance. In the event of no copper area being dedicated for heat spreading, a multi-layer board construction using only the minimum size pad layout will typically provide the CM3018 in a SOT23 package with an overall JA of 175C/W, which allows up to 450mW to be dissipated safely. Please consult CAMD Technical Support for assistance with thermal analysis of the CM3018 with respect to a specific application.
0
25
50
75
100 125
(c) 2004 California Micro Devices Corp. All rights reserved. 07/29/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
9
PRELIMINARY CM3018
Mechanical Details
SOT23 Mechanical Specifications Dimensions for CM3018 devices packaged in 5-pin SOT23 packages are presented below. For complete information on the SOT23 package, see the California Micro Devices SOT23 Package Information document.
5
Mechanical Package Diagrams
TOP VIEW
e1
e
4
PACKAGE DIMENSIONS
Package Pins Dimensions A A1 b c D E E1 e e1 L # per tape and reel Millimeters Min -0.00 0.30 0.08 2.75 2.60 1.45 Max 1.45 0.15 0.50 0.22 3.05 3.00 1.75 Min -0.000 0.012 0.003 0.108 0.102 0.057 SOT23 (JEDEC name is MO-178) 5 Inches Max 0.057 0.006 0.020 0.009 0.120 0.118 0.069 D
SIDE VIEW 1 2 3
E1 E
b
A
A1
END VIEW
0.95 BSC 1.90 BSC 0.60 REF
0.0374 BSC 0.0748 BSC 0.0236 REF 3000 pieces c
Controlling dimension: inches L1
Package Dimensions for SOT23-5.
(c) 2004 California Micro Devices Corp. All rights reserved.
10 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
07/29/04
PRELIMINARY CM3018
Mechanical Details
CSP Mechanical Specifications CM3018CS/CP devices are packaged in a custom Chip Scale Package (CSP) with OptiGuardTM coating. Dimensions are presented below. For complete information on CSP packaging, see the California Micro Devices CSP Package Information document. Mechanical Package Diagrams
BOTTOM VIEW
A1 C1 B2 B1 B4 B3
OptiGuardTM Coating
PACKAGE DIMENSIONS
Package Bumps Dim A1 A2 B1 B2 B3 B4 C1 C2 D1 D2 Millimeters Min Nom Max Min Custom CSP 5 Inches Nom Max
C A2 B A 123 C2
0.961 1.006 1.051 0.0378 0.0396 0.0414 1.418 1.463 1.508 0.0558 0.0576 0.0594 0.495 0.500 0.505 0.0195 0.0197 0.0199 0.245 0.250 0.255 0.0096 0.0098 0.0100 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.430 0.435 0.440 0.0169 0.0171 0.0173 0.203 0.253 0.303 0.0080 0.0100 0.0119 0.247 0.297 0.347 0.0097 0.0117 0.0136 0.600 0.670 0.739 0.0236 0.0264 0.0291 0.394 0.445 0.495 0.0155 0.0175 0.0195 3500 pieces
0.30 DIA. 63/37 Sn/Pb SOLDER BUMPS
D1 D2
SIDE VIEW
DIMENSIONS IN MILLIMETERS
Custom 5-Bump Chip Scale Package
# per tape and reel
Controlling dimension: millimeters
CSP Tape and Reel Specifications
PART NUMBER CM3018 CHIP SIZE (mm) 1.463 X 1.006 X 0.670 POCKET SIZE (mm) B0 X A0 X K0 1.67 X 1.17 X 0.730
Po Top Cover Tape
TAPE WIDTH W 8mm
REEL DIAMETER 178mm (7")
QTY PER REEL 3500
P0 4mm
P1 4mm
10 Pitches Cumulative Tolerance On Tape 0.2 mm
Ao W Bo
Ko
For Tape Feeder Reference Only including Draft. Concentric Around B.
Embossment
P1 User Direction of Feed
Center Lines of Cavity
Figure 1. Tape and Reel Mechanical Data
(c) 2004 California Micro Devices Corp. All rights reserved. 07/29/04
430 N. McCarthy Blvd., Milpitas, CA 95035-5112
Tel: 408.263.3214
Fax: 408.263.7846
www.calmicro.com
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